In this marathon 6-hour stream, Seve dives deep into improving 3D component rendering for TS Circuit. He spends a significant portion tackling issues with the DIP (Dual Inline Package) component, meticulously adjusting its geometry and struggling with coordinate system inconsistencies. Seve also extends footprint string support, adding implementations for 0402, 0603, and 0805 components.
The stream showcases the challenges of integrating multiple libraries, with Seve navigating between JS-CAD, Three.js, and custom React reconcilers. He encounters and fixes numerous rotation and positioning bugs across different component types. Viewers get an inside look at the iterative process of tweaking 3D models, including a detailed session on crafting the curved leads for the DIP package using expanded SVG strokes.
Seve also touches on project maintenance, updating dependencies, fixing CI/CD pipelines, and improving documentation. The stream concludes with a payoff as Seve finally gets to see the fruits of his labor - newly rendered 3D components in the TS Circuit snippets interface.
Throughout, Seve shares insights on open-source development, AI-assisted coding, and the intricacies of building a complex electronics design tool in TypeScript and React.
3D Component Rendering Marathon: Fixing DIP Packages and Footprint Strings